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Innovative Material Solutions for the
Automotive Electronics Industry
Graphene
thermal pads
Preferred thermal solution for
high-TOPS autonomous driving
chips, with extremely low thermal
resistance
SMT gasket
In-vehicle electronic EMC providing
full-scenario protection, shielding
interference and stabilizing signals.
Waveabsorbing
materials
Solving the problem of millimeter
wave radar interference, flexible fix,
and strong wave absorption.
Thermal
conductive
gel
Optimal for smart cockpit heat
dissipation, highly adaptable filling,
and efficient automation.
Heat sink
Chips Thermal resistance
Ultra-Performance
Graphene thermal pad structure Product characteristics
Graphene thermal pads HFC's innovative new-generation longitudinal graphene
thermal pads, with their high resilience, ultra-low thermal
resistance, and excellent reliability, have become the optimal
solution for heat dissipation in autonomous driving.
High reliability Low thermal
resistance
Continuous and high thermal
conductive graphene structure for
heat conduction
Highly flexible graphene foam
structure for deformation
Thermal resistance under different pressure conditions
Compression ratio under different pressures
High resilience Zero pump-out
Autonomous driving chip
Domain controller
Centralized compute
architecture
? High thermal conductivity (70~130W/m·K)
? High resilience rate
? Low thermal resistance (as low as 0.05°Ccm 2 /W)
? Low compressive stress
? Low density
Cross-section views
Test pressure (PSI)
Compression ratio (%)
Test pressure (PSI)
Ultra-Low Thermal Resistance
Thermal resistance decreases with applied pressure
and stabilizes at as low as 0.05 ℃·cm2/W, enabling highly
efficient heat transfer under real-world operating conditions.
Excellent Compressibility
Achieves >50% compression at 50 psi, effectively
conforming to surface irregularities and mitigating thermal
bottlenecks caused by die warpage and uneven mating surfaces.
High Resilience
Recovers over 70% of its original thickness after 50%
compression, maintaining consistent interface contact and
minimizing long-term thermal resistance drift.
Zero Pump-Out
No migration or extrusion under sustained dynamic
loading — dimensional stability near zero. Eliminates
dry-out and void formation common in traditional thermal greases.
Proven Long-Term Reliability
Thermal resistance increase ≤5% after rigorous environmental aging:
1000 hours at 125°C (High-Temperature Storage)
1000 cycles from -40°C to 125°C (Thermal Cycling)
1000 hours at 85°C / 85% RH (High Temp & Humidity)
Before test Constant
temperature
and humidity
Constant
temperature
and humidity
Cold & Heat impact Cold & Heat impact High temperature High temperature Low temperature Low temperature
Thermal gel is an excellent material matching the heat dissipation
design of automotive electronic equipment relying on its high adaptability,
vibration resistance and automatic assembly.
The wave-absorbing material with high attenuation and good flexibility is an
excellent choice for eliminating self-excitation in 77GHz automotive millimeter
wave radars.
High (can fill complex curved surfaces)
Various types available
Domain control
system
Millimeter wave
radar
Thermal conductivity
Interface adaptability
Long-term stability >10 years (no pump-out effect)
Operational convenience Support automation
Wave-absorbing
materials
Typical
attenuation curve
Product characteristics Durability test
SMT gasket
Thermal gel
Wave-absorbing materials
SMT gasket, reyling on its excellent conductivity, shielding effectiveness and extremely high reliability, can effectively block
interference, absorb shock, protect components, provide stable grounding, and reduce secondary interference caused by poor
contact, thus ensuring the high reliability of automotive electronic systems in complex electromagnetic environments.
Automotive electronics
PCBA
? Automotive smart cockpit
? Automotive audio and
video system
? Automotive smart screen
? Automotive electronics
? Low impedance
? Super high resilience
? Low compression loss
? Excellent heat resistance and durability
? Mechanical structure stability
? Automatic mounting, capable of secondary soldering
Type A
Rubber used as
elastic filler
SMT foam durability resistance change SMT foam compression set
The vertical resistance of durability test has basically
no change, compression set ≤10%
Type B
Silicone gasket used
as elastic filler
Sample 1 Sample 2 Sample 3
Sample 4 Sample 5 Average value
Gold-plated SMT Gasket
Gold-plated PI layer
featuring good
conductive stability
Tin/Nickel-plated SMT
Gasket
Tin/Nickel-plated PI
layer has a wide range
of applications
Vertical resistance (mΩ)
Reflection loss (dB)
Frequency (GHz)
Compression set
1~14W/m·K
Thermal
analysis
Passed· IATF· 16949
Six major manufacturing bases
SHENZHEN HFC CO., LTD
Passed CNAS laboratory accreditation
Five international management system certifications, providing high-standard supply chain quality assurance
F3, Buildings A & B, No. 11 Tengfeng 4th Road;
F1~F3, Building C, No. 7 Fuyong Street,
Fenghuang Community, Bao'an District,
Shenzhen,China.
Comprehensive and professional testing in five major
performance testing laboratories
Electrical
performance
Safety /EMC
SHENZHEN CHONGQING ZHEJIANG WUHAN MALAYSIA THAILAND
Magnetic
Darkroom /VNA
Mechanics
Shock/Fatigue
Environmental
Salt spray /UV
https://hfcsz.com/
